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Jan Rabaey
Low Power Design Essentials
Springer US
2017
Taschenbuch
380 Seiten
123,04
€
in Kürze
This book contains all the topics of importance to the low power designer. It first lays the foundation and then goes on to detail the design process…
eng
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Springer US
2016
Taschenbuch
1528 Seiten
534,99
€
in Kürze
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro…
eng
Keren Bergman / Luca P. Carloni …
Photonic Network-on-Chip Design
Springer New York
2016
Taschenbuch
224 Seiten
119,99
€
in Kürze
This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing…
eng
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Springer New York
2014
Taschenbuch
572 Seiten
160,49
€
in Kürze
In Advanced ULSI interconnects ¿ fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra…
eng
Fine- and Coarse-Grain Reconfigurable Computing
Springer Netherlands
2014
Taschenbuch
400 Seiten
106,99
€
in Kürze
The basic concepts and building blocks for the design of Fine- (or FPGA) and Coarse-Grain Reconfigurable Architectures are discussed in this book. Re…
eng
W David Schwaderer
Introduction to Open Core Protocol
Fastpath to System-on-Chip Design
Springer New York
2014
Taschenbuch
180 Seiten
119,99
€
in Kürze
This book introduces Open Core Protocol (OCP) not as a conventional hardware communications protocol but as a meta-protocol: a means for describing a…
eng
Luc Martens
High-Frequency Characterization of Electronic Packaging
Springer US
2014
Taschenbuch
176 Seiten
106,99
€
in Kürze
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Unde…
eng
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Springer US
2014
Taschenbuch
372 Seiten
160,49
€
in Kürze
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called …
eng
Eugene J. Rymaszewski / Jain Pushkar
Thin-Film Capacitors for Packaged Electronics
Springer US
2014
Taschenbuch
180 Seiten
106,99
€
in Kürze
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands p…
eng
Phil Marcoux
Fine Pitch Surface Mount Technology
Quality, Design, and Manufacturing Techniques
Springer US
2014
Taschenbuch
356 Seiten
213,99
€
in Kürze
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components …
eng
Optoelectronic Integration: Physics, Technology and Applications
Springer US
2014
Taschenbuch
476 Seiten
213,99
€
in Kürze
As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary …
eng
John H. Lau
Solder Joint Reliability
Theory and Applications
Springer US
2014
Taschenbuch
656 Seiten
213,99
€
in Kürze
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic c…
eng
Billinton / R. N. Allan
Reliability Evaluation of Power Systems
Springer US
2013
Taschenbuch
536 Seiten
181,89
€
in Kürze
This book is a seque1 to Reliability Evaluation of Engineering Systems: Concepts and Techniques, written by the same authors and published by Pitman …
eng
Keren Bergman / Luca P. Carloni …
Photonic Network-on-Chip Design
Springer New York
2013
Gebunden
224 Seiten
106,99
€
in Kürze
This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing…
eng
Directions for the Next Generation of MMIC Devices and Systems
Springer US
2013
Taschenbuch
428 Seiten
160,49
€
in Kürze
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im portance in modern military and commercial wireless communication sys…
eng
Ultra-Wideband, Short-Pulse Electromagnetics 2
Springer US
2013
Taschenbuch
620 Seiten
213,99
€
in Kürze
The papers published in this volume were presented at the Second International Conference on Ultra-WidebandiShort-Pulse (UWB/SP) Electromagnetics, Ap…
eng
Pinhong Chen / Kurt Keutzer …
Static Crosstalk-Noise Analysis
For Deep Sub-Micron Digital Designs
Springer US
2013
Taschenbuch
132 Seiten
106,99
€
in Kürze
As the feature size decreases in deep sub-micron designs, coupling capacitance becomes the dominant factor in total capacitance. The resulting crosst…
eng
David J. Allstot / Kiyong Choi …
Parasitic-Aware Optimization of CMOS RF Circuits
Springer US
2013
Taschenbuch
184 Seiten
106,99
€
in Kürze
In the arena of parasitic-aware design of CMOS RF circuits, efforts are aimed at the realization of true single-chip radios with few, if any, off-chi…
eng
Dan McMahill
Automated Calibration of Modulated Frequency Synthesizers
Springer US
2013
Taschenbuch
176 Seiten
106,99
€
in Kürze
In recent years, there has been considerable interest in highly integrated, low power, portable wireless devices. This monograph focuses on the probl…
eng
Anthony S. Acampora
An Introduction to Broadband Networks
LANs, MANs, ATM, B-ISDN, and Optical Networks for Integrated Multimedia Telecommunications
Springer US
2013
Taschenbuch
352 Seiten
160,49
€
in Kürze
This is an elementary textbook on an advanced topic: broadband telecommunica tion networks. I must declare at the outset that this book is not prima…
eng
Vijay K. Sood
HVDC and FACTS Controllers
Applications of Static Converters in Power Systems
Springer US
2013
Taschenbuch
324 Seiten
160,49
€
in Kürze
HVDC and FACTS Controllers: Applications of Static Converters in Power Systems focuses on the technical advances and developments that have taken pla…
eng
Sumit Gupta / Alexandru Nicolau …
SPARK: A Parallelizing Approach to the High-Level Synthesis of Digital Circuits
Springer US
2013
Taschenbuch
260 Seiten
160,49
€
in Kürze
Rapid advances in microelectronic integration and the advent of Systems-on- Chip have fueled the need for high-level synthesis, i.e., an automated ap…
eng
Oliver Landolt
Place Coding in Analog VLSI
A Neuromorphic Approach to Computation
Springer US
2013
Taschenbuch
232 Seiten
160,49
€
in Kürze
Neurobiology research suggests that information can be represented by the location of an activity spot in a population of cells (`place coding'), and…
eng
Network Interdiction and Stochastic Integer Programming
Springer US
2013
Taschenbuch
140 Seiten
53,49
€
in Kürze
On March 15, 2002 we held a workshop on network interdiction and the more general problem of stochastic mixed integer programming at the University o…
eng
Communication Systems
The State of the Art IFIP 17th World Computer Congress - TC6 Stream on Communication Systems: The State of the Art August 25¿30, 2002, Montréal, Québec, Canada
Springer US
2013
Taschenbuch
248 Seiten
160,49
€
in Kürze
Communication Systems: The State of the Art captures the depth and breadth of the field of communication systems: -Architectures and Protocols for Di…
eng
Computer Network Architectures and Protocols
Springer US
2012
Taschenbuch
560 Seiten
53,49
€
in Kürze
eng
Area Array Interconnection Handbook
Springer US
2012
Taschenbuch
1332 Seiten
53,49
€
in Kürze
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the…
eng
Martin Weik
Fiber Optics Standard Dictionary
Springer US
2012
Taschenbuch
1276 Seiten
213,99
€
in Kürze
Fiber Optics Vocabulary Development In 1979, the National Communications System published Technical InfonnationBulle tin TB 79-1, Vocabulary for Fib…
eng
Microelectronic Interconnections and Assembly
Springer Netherlands
2012
Taschenbuch
316 Seiten
53,49
€
in Kürze
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) …
eng
Kenneth E. Goodson / Y. Sungtaek Ju
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Springer US
2012
Taschenbuch
128 Seiten
106,99
€
in Kürze
Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization al…
eng
Hermann A. Haus / Christina Manolatou
Passive Components for Dense Optical Integration
Springer US
2012
Taschenbuch
184 Seiten
106,99
€
in Kürze
This volume presents a theoretical and numerical investigation of high index- contrast passive components that can serve as building blocks at the en…
eng
Gerard Ledwich / Arindam Ghosh
Power Quality Enhancement Using Custom Power Devices
Springer US
2012
Taschenbuch
484 Seiten
192,59
€
in Kürze
Power Quality Enhancement Using Custom Power Devices considers the structure, control and performance of series compensating DVR, the shunt DSTATCOM …
eng
Pallab Chatterjee
Legacy Data: A Structured Methodology for Device Migration in DSM Technology
Springer US
2012
Taschenbuch
152 Seiten
106,99
€
in Kürze
This unique book deals with the migration of existing hard IP from one technology to another, using repeatable procedures. It will allow CAD practiti…
eng
Jan M. Rabaey / Varghese George
Low-Energy FPGAs ¿ Architecture and Design
Springer US
2012
Taschenbuch
196 Seiten
106,99
€
in Kürze
Low-Energy FPGAs: Architecture and Design is a primary resource for both researchers and practicing engineers in the field of digital circuit design.…
eng
Alexander Weinmann
Uncertain Models and Robust Control
Springer Vienna
2012
Taschenbuch
732 Seiten
53,49
€
in Kürze
This coherent introduction to the theory and methods of robust control system design clarifies and unifies the presentation of significant derivation…
eng
Puligandla Viswanadham / P. Singh
Failure Modes and Mechanisms in Electronic Packages
Springer US
2012
Taschenbuch
396 Seiten
171,19
€
in Kürze
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes tha…
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