inter­ faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand­ ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris­ tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.