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Cookie akzeptieren![Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering - Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer International Publishing, 2019.](https://eichendorff21.de/cdata/fXPcDitRGmOMo5j2pvNXwGrenZw=/300x0/9783030085612.png)
Seonho Seok
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
- Springer International Publishing
- 2019
- Taschenbuch
- 124 Seiten
- ISBN 9783030085612
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ¿ a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss
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